Edraw Office Viewer Component 11.5.1 Crack is a professional Office Viewer component for Microsoft Word, Powerpoint, Excel, Visio and Publisher, which contains a standard ActiveX control that acts as an ActiveX document container for hosting Office documents.
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It is an impressive tool for various types of diagrams like flowcharts, network diagrams, organizational charts, etc.
Oasissoft Inc. is a software development company. We develop a series of professional diagramming tools for MS Office users. One of the most popular software products in our series is Diagram.
Diagram provides professional diagramming tools for both Mac and Windows users. Diagram supports all major MS Office software including Microsoft Word, Excel, PowerPoint, Visio and Publisher. Diagram is easy to use and has many innovative features.The present invention relates generally to semiconductor fabrication and, more particularly, to fabricating dual damascene interconnect structures within the semiconductor fabrication.
Integrated circuits are comprised of millions of active devices formed in or on a silicon substrate or well. The active devices are interconnected together by means of metal lines and interconnecting devices formed in one or more layers of insulating materials formed on the substrate. Interconnect structures are formed by depositing a dielectric layer on the substrate and then patterning and etching holes or trenches in the layer of dielectric to the desired depth and shape. The openings or trenches are then filled with a conductive material, such as copper, to form the desired interconnect structure.
As the interconnect structures are scaled to smaller dimensions, the interconnects have become more important than the dielectric layers. That is, as more and more active devices are packed into a smaller area of the silicon substrate, the interconnect structures must also scale down to meet the density requirements. However, the reduction in dimensions has resulted in the reduction in the spacing of the interconnect structures. This reduction in spacing between the interconnect structures has undesirably resulted in the increase in the capacitance and resistance of the interconnect 0b46394aab